Spalling of a Thin Si Layer by Electrodeposit-Assisted Stripping

Applied Physics Express 6(11) 116502

https://doi.org/10.7567/APEX.6.116502

Youngim Kwon, Changyol Yang, Sang-Hwa Yoon, Han-Don Um, Jung-Ho Lee and Bongyoung Yoo

Abstract

A major goal in solar cell research is to reduce the cost of the final module. Reducing the thickness of the crystalline silicon substrate to several tens of micrometers can reduce material costs. In this work, we describe the electrodeposition of a Ni–P alloy, which induces high stress in the silicon substrate at room temperature. The induced stress enables lift-off of the thin-film silicon substrate. After lift-off of the thin Si film, the mother substrate can be reused, reducing material costs. Moreover, the low-temperature process expected to be improved Si substrate quality.